摘要：MPC5510KIT是支持飞思卡尔MPC5510微控制器的评估系统。它包含一个评估板MPC5510EVB和子卡，采用144LQFP或208MAPBGA封装，插入到评估板上。  该评估系统允许调试通过Nexus连接器完全访问MCU。

Keywords：body electronics，variable length encoding， MPC5510

基本特性：

Designed for body electronics, the Qorivva MPC5510 belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle. Freescale’s advanced cost-efficient Qorivva MPC5510 automotive controller family is built on Power Architecture® technology. It operates at speeds of up to 80 MHz with two e200z cores offering high-performance processing and flexibility while continuing to meet low-power requirements.

Product Benefits：

Enables centralized architectures, which reduce the number of distributed electronic control units (ECU) and complexity of vehicle architectures

Connects FlexRay™ nodes to the body electronics domain

Exceeds 100 Dhrystone MIPS (DMIPS) performance

Minimizes ECU leakages below 200 µA, depending on functionality

Provides extensive communication capabilities including FlexRay, multiple CAN and LIN support

Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash

Leverages Power Architecture network for third-party tools and software

Features

Power Architecture e200z1 core with variable length encoding (VLE)

Optional VLE-only 32/16-bit e200z0 secondary core

16-channel eDMA (enhanced direct memory access)

Memory management unit (MMU) with 4-entry translation look-aside buffer (TLB)

Multiple low-power modes

JTAG and Nexus class 2+ debug support

Up to 1.5 MB of flash with error correction coding (ECC)

The flash module features read while write (RWW) and small partitions for optimal bootloader and EEPROM emulation support

Up to 80 KB of SRAM with ECC

Memory protection unit (MPU) with up to 16 regions and 32B granularity

This product is included in Freescale’s product longevity program, with assured supply for a minimum of 15 years after launch

方案描述：

The EVB is intended to provide a mechanism for easy customer evaluation of the MPC5510 family of microprocessors, and to facilitate hardware and software development.

There are currently 3 package types supported within the MPC5510 family (and by the EVB), namely 208BGA, 176QFP and 144QFP.

For maximum flexibility and simplicity, the EVB has been designed as a modular development platform. The EVB main board does not contain an MCU. Instead, the MCU is fitted to an MCU daughter card (sometimes referred to as an adapter board). This approach means that the same EVB platform can be used for multiple package and MCU derivatives within the MPC5510 family. High density connectors provide the interface between the EVB and MCU daughter cards as shown in the diagram below. See section 4 for more information on the daughter card configuration.

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